﻿<?xml version="1.0" encoding="utf-8" ?>
<XML>
  <ISCJOURNAL>
    <YEAR>2021</YEAR>
    <VOL>3</VOL>
    <NO>7</NO>
    <MOSALSAL>7</MOSALSAL>
    <PAGE_NO>8</PAGE_NO>
    <ARTICLES>
      <ARTICLE>
        <LANGUAGE_ID>1</LANGUAGE_ID>
        <TitleF/>
        <TitleE>Electrodeposition of Nickel matrix composite coatings via various Boride particles:
          A review</TitleE>
        <URL>https://jourcc.com/index.php/jourcc/article/view/jcc324</URL>
        <DOI>10.52547/jcc.3.2.4</DOI>
        <DOR>20.1001.1.26765837.2021.3.7.4.9</DOR>
        <ABSTRACTS>
          <ABSTRACT>
            <LANGUAGE_ID>1</LANGUAGE_ID>
            <CONTENT>Composite electrodeposition or Electroplating is a process primarily applied in
              the industry through which metal substrates are coated with an additional phase, such
              as low-thickness films of a range of metals. Lately, the advent of coating based on
              metal matrix through deposition has been vital because the superior hardness has more
              improved wear and corrosion resistance than alloy-based or pure coatings of metal.
              Nickel is an engineering material, which has been broadly utilized for metal matrix
              applications. This paper summarizes recent research on the electrodeposition of nickel
              matrix composite coatings with borides ceramic particles. Some of these particles are
              ZrB2, BN, TiB2, Ni3B, CrB2, etc. in the nickel matrix. In addition, the most important
              results achieved in the field of these composite coatings were collected in this
              review.</CONTENT>
          </ABSTRACT>
        </ABSTRACTS>
        <PAGES>
          <PAGE>
            <FPAGE>106</FPAGE>
            <TPAGE>113</TPAGE>
          </PAGE>
        </PAGES>
        <AUTHORS>
          <AUTHOR>
            <Name/>
            <MidName/>
            <Family/>
            <NameE>Alireza</NameE>
            <MidNameE/>
            <FamilyE>Dordsheikh Torkamani</FamilyE>
            <Organizations>
              <Organization>Iran University of Science and Technology (IUST)</Organization>
            </Organizations>
            <Countries>
              <Country>Iran</Country>
            </Countries>
            <EMAILS>
              <Email>info@jourcc.com</Email>
            </EMAILS>
          </AUTHOR>
          <AUTHOR>
            <Name/>
            <MidName/>
            <Family/>
            <NameE>Mohammad</NameE>
            <MidNameE/>
            <FamilyE>Velashjerdi</FamilyE>
            <Organizations>
              <Organization>Arak University</Organization>
            </Organizations>
            <Countries>
              <Country>Iran</Country>
            </Countries>
            <EMAILS>
              <Email>mm.velashjerdi@gmail.com</Email>
            </EMAILS>
          </AUTHOR>
          <AUTHOR>
            <Name/>
            <MidName/>
            <Family/>
            <NameE>Aqeel</NameE>
            <MidNameE/>
            <FamilyE>Abbas</FamilyE>
            <Organizations>
              <Organization>National Taiwan University</Organization>
            </Organizations>
            <Countries>
              <Country>China</Country>
            </Countries>
            <EMAILS>
              <Email>info@jourcc.com</Email>
            </EMAILS>
          </AUTHOR>
          <AUTHOR>
            <Name/>
            <MidName/>
            <Family/>
            <NameE>Mohammad</NameE>
            <MidNameE/>
            <FamilyE>Bolourchi</FamilyE>
            <Organizations>
              <Organization>Iran University of Science and Technology (IUST)</Organization>
            </Organizations>
            <Countries>
              <Country>Iran</Country>
            </Countries>
            <EMAILS>
              <Email>info@jourcc.com</Email>
            </EMAILS>
          </AUTHOR>
          <AUTHOR>
            <Name/>
            <MidName/>
            <Family/>
            <NameE>Pabitra</NameE>
            <MidNameE/>
            <FamilyE>Maji</FamilyE>
            <Organizations>
              <Organization>NIT Agartala</Organization>
            </Organizations>
            <Countries>
              <Country>India</Country>
            </Countries>
            <EMAILS>
              <Email>info@jourcc.com</Email>
            </EMAILS>
          </AUTHOR>
        </AUTHORS>
        <KEYWORDS>
          <KEYWORD>
            <KeyText>Electroplating</KeyText>
          </KEYWORD>
          <KEYWORD>
            <KeyText>Composite coatings</KeyText>
          </KEYWORD>
          <KEYWORD>
            <KeyText>Nickel matrix</KeyText>
          </KEYWORD>
          <KEYWORD>
            <KeyText>Borides</KeyText>
          </KEYWORD>
        </KEYWORDS>
        <PDFFileName>Article4.pdf</PDFFileName>
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